Wang, Hong (2011) Optimization of the Process Conditions Based on Depositing Rate and Micro-Hardness for Electroless Ni-P-Nano SiC Composite Plating. Advanced Materials Research, 339. 483-486 doi:10.4028/www.scientific.net/amr.339.483
| Reference Type | Journal (article/letter/editorial) | ||
|---|---|---|---|
| Title | Optimization of the Process Conditions Based on Depositing Rate and Micro-Hardness for Electroless Ni-P-Nano SiC Composite Plating | ||
| Journal | Advanced Materials Research | ||
| Authors | Wang, Hong | Author | |
| Year | 2011 (September) | Volume | 339 |
| Publisher | Trans Tech Publications, Ltd. | ||
| DOI | doi:10.4028/www.scientific.net/amr.339.483Search in ResearchGate | ||
| Generate Citation Formats | |||
| Mindat Ref. ID | 11656602 | Long-form Identifier | mindat:1:5:11656602:9 |
| GUID | 0 | ||
| Full Reference | Wang, Hong (2011) Optimization of the Process Conditions Based on Depositing Rate and Micro-Hardness for Electroless Ni-P-Nano SiC Composite Plating. Advanced Materials Research, 339. 483-486 doi:10.4028/www.scientific.net/amr.339.483 | ||
| Plain Text | Wang, Hong (2011) Optimization of the Process Conditions Based on Depositing Rate and Micro-Hardness for Electroless Ni-P-Nano SiC Composite Plating. Advanced Materials Research, 339. 483-486 doi:10.4028/www.scientific.net/amr.339.483 | ||
| In | (n.d.) Advanced Materials Research Vol. 339. Trans Tech Publications, Ltd. | ||
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