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Han, Zhi Yong, Wang, Huan (2011) Relation between 3 Dimension Interface Topography and Residual Stress in Thermal Barrier Coatings. Advanced Materials Research, 217. 964-968 doi:10.4028/www.scientific.net/amr.217-218.964

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Reference TypeJournal (article/letter/editorial)
TitleRelation between 3 Dimension Interface Topography and Residual Stress in Thermal Barrier Coatings
JournalAdvanced Materials Research
AuthorsHan, Zhi YongAuthor
Wang, HuanAuthor
Year2011 (March)Volume217
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/amr.217-218.964Search in ResearchGate
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Mindat Ref. ID11639625Long-form Identifiermindat:1:5:11639625:1
GUID0
Full ReferenceHan, Zhi Yong, Wang, Huan (2011) Relation between 3 Dimension Interface Topography and Residual Stress in Thermal Barrier Coatings. Advanced Materials Research, 217. 964-968 doi:10.4028/www.scientific.net/amr.217-218.964
Plain TextHan, Zhi Yong, Wang, Huan (2011) Relation between 3 Dimension Interface Topography and Residual Stress in Thermal Barrier Coatings. Advanced Materials Research, 217. 964-968 doi:10.4028/www.scientific.net/amr.217-218.964
In(n.d.) Advanced Materials Research Vol. 217. Trans Tech Publications, Ltd.

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(2011) Advanced Materials Research, 217. Trans Tech Publications, Ltd. doi:10.4028/www.scientific.net/amr.217-218
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