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Huang, Mei Fa, Huang, Jiang Tai, Cheng, Xiong, Zhang, Jing, Jing, Hui (2011) Tolerance Modeling and Optimization of XY-Table for LED Die Bonder Based on Multi-Body Systems. Advanced Materials Research, 201. 2922-2926 doi:10.4028/www.scientific.net/amr.201-203.2922

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Reference TypeJournal (article/letter/editorial)
TitleTolerance Modeling and Optimization of XY-Table for LED Die Bonder Based on Multi-Body Systems
JournalAdvanced Materials Research
AuthorsHuang, Mei FaAuthor
Huang, Jiang TaiAuthor
Cheng, XiongAuthor
Zhang, JingAuthor
Jing, HuiAuthor
Year2011 (February)Volume201
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/amr.201-203.2922Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID11637877Long-form Identifiermindat:1:5:11637877:6
GUID0
Full ReferenceHuang, Mei Fa, Huang, Jiang Tai, Cheng, Xiong, Zhang, Jing, Jing, Hui (2011) Tolerance Modeling and Optimization of XY-Table for LED Die Bonder Based on Multi-Body Systems. Advanced Materials Research, 201. 2922-2926 doi:10.4028/www.scientific.net/amr.201-203.2922
Plain TextHuang, Mei Fa, Huang, Jiang Tai, Cheng, Xiong, Zhang, Jing, Jing, Hui (2011) Tolerance Modeling and Optimization of XY-Table for LED Die Bonder Based on Multi-Body Systems. Advanced Materials Research, 201. 2922-2926 doi:10.4028/www.scientific.net/amr.201-203.2922
In(n.d.) Advanced Materials Research Vol. 201. Trans Tech Publications, Ltd.

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