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Wang, Jiang Tao, Shen, Ming Qian, Xue, Tao, Dai, Guo Hong (2011) Numerical Simulation of Punching Bonding Based on AutoForm. Advanced Materials Research, 189. 3423-3426 doi:10.4028/www.scientific.net/amr.189-193.3423

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Reference TypeJournal (article/letter/editorial)
TitleNumerical Simulation of Punching Bonding Based on AutoForm
JournalAdvanced Materials Research
AuthorsWang, Jiang TaoAuthor
Shen, Ming QianAuthor
Xue, TaoAuthor
Dai, Guo HongAuthor
Year2011 (February)Volume189
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/amr.189-193.3423Search in ResearchGate
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Mindat Ref. ID11635854Long-form Identifiermindat:1:5:11635854:9
GUID0
Full ReferenceWang, Jiang Tao, Shen, Ming Qian, Xue, Tao, Dai, Guo Hong (2011) Numerical Simulation of Punching Bonding Based on AutoForm. Advanced Materials Research, 189. 3423-3426 doi:10.4028/www.scientific.net/amr.189-193.3423
Plain TextWang, Jiang Tao, Shen, Ming Qian, Xue, Tao, Dai, Guo Hong (2011) Numerical Simulation of Punching Bonding Based on AutoForm. Advanced Materials Research, 189. 3423-3426 doi:10.4028/www.scientific.net/amr.189-193.3423
In(n.d.) Advanced Materials Research Vol. 189. Trans Tech Publications, Ltd.

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