| Reference Type | Journal (article/letter/editorial) |
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| Title | Modeling of Thermal Exposure Effect on the Microstructure Evolution and Properties of High Cu/Mg Ratio Al-Cu-Mg-Ag Alloys |
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| Journal | Advanced Materials Research |
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| Authors | Hou, Yan Hui | Author |
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| Liu, Zhi Yi | Author |
| Li, Guang Qiang | Author |
| Xia, Qing Kun | Author |
| Year | 2010 (October) | Volume | 148 |
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| Publisher | Trans Tech Publications, Ltd. |
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| DOI | doi:10.4028/www.scientific.net/amr.148-149.136Search in ResearchGate |
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| Generate Citation Formats |
| Mindat Ref. ID | 11629595 | Long-form Identifier | mindat:1:5:11629595:0 |
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| GUID | 0 |
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| Full Reference | Hou, Yan Hui, Liu, Zhi Yi, Li, Guang Qiang, Xia, Qing Kun (2010) Modeling of Thermal Exposure Effect on the Microstructure Evolution and Properties of High Cu/Mg Ratio Al-Cu-Mg-Ag Alloys. Advanced Materials Research, 148. 136-140 doi:10.4028/www.scientific.net/amr.148-149.136 |
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| Plain Text | Hou, Yan Hui, Liu, Zhi Yi, Li, Guang Qiang, Xia, Qing Kun (2010) Modeling of Thermal Exposure Effect on the Microstructure Evolution and Properties of High Cu/Mg Ratio Al-Cu-Mg-Ag Alloys. Advanced Materials Research, 148. 136-140 doi:10.4028/www.scientific.net/amr.148-149.136 |
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| In | (n.d.) Advanced Materials Research Vol. 148. Trans Tech Publications, Ltd. |
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