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Li, Hui, Lu, Bin (2010) Effect of Adding Er on Interfacial Reactions between Sn-3.0Ag-0.5Cu Solder and Cu Substrate. Advanced Materials Research, 136. 28-32 doi:10.4028/www.scientific.net/amr.136.28

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Reference TypeJournal (article/letter/editorial)
TitleEffect of Adding Er on Interfacial Reactions between Sn-3.0Ag-0.5Cu Solder and Cu Substrate
JournalAdvanced Materials Research
AuthorsLi, HuiAuthor
Lu, BinAuthor
Year2010 (October)Volume136
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/amr.136.28Search in ResearchGate
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Mindat Ref. ID11628015Long-form Identifiermindat:1:5:11628015:4
GUID0
Full ReferenceLi, Hui, Lu, Bin (2010) Effect of Adding Er on Interfacial Reactions between Sn-3.0Ag-0.5Cu Solder and Cu Substrate. Advanced Materials Research, 136. 28-32 doi:10.4028/www.scientific.net/amr.136.28
Plain TextLi, Hui, Lu, Bin (2010) Effect of Adding Er on Interfacial Reactions between Sn-3.0Ag-0.5Cu Solder and Cu Substrate. Advanced Materials Research, 136. 28-32 doi:10.4028/www.scientific.net/amr.136.28
In(n.d.) Advanced Materials Research Vol. 136. Trans Tech Publications, Ltd.

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Hua, Li, Sou, Ming Wei, Zhang, Wei Jun, Hu, Q L (2011) Electrochemical Migration and Rapid Whisker Growth of Zn and Bi Dopings in Sn-3.0Ag-0.5Cu Solder in 3wt.% NaCl Solution. Advanced Materials Research, 239. 1751-1760 doi:10.4028/www.scientific.net/amr.239-242.1751
Lee, Chang Woo, Shin, Y.S., Kim, J.H. (2008) Precise Quantitative Evaluation of Nano-Ordered Intermetallic Compounds in Sn-3.0Ag-0.5Cu Lead-Free Solder Bump by Using TEM. Advanced Materials Research, 47. 907-911 doi:10.4028/www.scientific.net/amr.47-50.907
Ma, Li, Hu, Qiang, Sun, Yan Bin (2015) Effect of Cu on the Electrochemical Corrosion Behavior of Sn-8Zn-3Bi Lead-Free Solder Alloy. Advanced Materials Research, 1095. 95-98 doi:10.4028/www.scientific.net/amr.1095.95
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He, Siliang, Gao, Runhua, Shen, Yu-An, Li, Jiahui, Nishikawa, Hiroshi (2020) Wettability, interfacial reactions, and impact strength of Sn–3.0Ag–0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere. Journal of Materials Science, 55. 3107-3117 doi:10.1007/s10853-019-04153-9
Yen, Yee-wen, Liou, Wei-kai (2007) Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free solder and Ni substrate. Journal of Materials Research, 22 (10) 2663-2667 doi:10.1557/jmr.2007.0339
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