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Lee, Jae Young, Choi, Bum Choul, Lee, Hong Ki (2010) Estimation of Cure and Thermal Degradation Kinetics of Epoxy/Organoclay Nanocomposite. Advanced Materials Research, 123. 667-670 doi:10.4028/www.scientific.net/amr.123-125.667

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Reference TypeJournal (article/letter/editorial)
TitleEstimation of Cure and Thermal Degradation Kinetics of Epoxy/Organoclay Nanocomposite
JournalAdvanced Materials Research
AuthorsLee, Jae YoungAuthor
Choi, Bum ChoulAuthor
Lee, Hong KiAuthor
Year2010 (August)Volume123
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/amr.123-125.667Search in ResearchGate
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Mindat Ref. ID11627100Long-form Identifiermindat:1:5:11627100:8
GUID0
Full ReferenceLee, Jae Young, Choi, Bum Choul, Lee, Hong Ki (2010) Estimation of Cure and Thermal Degradation Kinetics of Epoxy/Organoclay Nanocomposite. Advanced Materials Research, 123. 667-670 doi:10.4028/www.scientific.net/amr.123-125.667
Plain TextLee, Jae Young, Choi, Bum Choul, Lee, Hong Ki (2010) Estimation of Cure and Thermal Degradation Kinetics of Epoxy/Organoclay Nanocomposite. Advanced Materials Research, 123. 667-670 doi:10.4028/www.scientific.net/amr.123-125.667
In(n.d.) Advanced Materials Research Vol. 123. Trans Tech Publications, Ltd.

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