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Chang, Yan Jun, Zhang, Ke Shi, Hu, Hui Juan, Jiao, Gui Qiong (2010) Characterization of Tensile Damage for 3D-C/SiC Composites by Acoustic Emission. Advanced Materials Research, 97. 834-837 doi:10.4028/www.scientific.net/amr.97-101.834

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Reference TypeJournal (article/letter/editorial)
TitleCharacterization of Tensile Damage for 3D-C/SiC Composites by Acoustic Emission
JournalAdvanced Materials Research
AuthorsChang, Yan JunAuthor
Zhang, Ke ShiAuthor
Hu, Hui JuanAuthor
Jiao, Gui QiongAuthor
Year2010 (March)Volume97
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/amr.97-101.834Search in ResearchGate
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Mindat Ref. ID11625182Long-form Identifiermindat:1:5:11625182:6
GUID0
Full ReferenceChang, Yan Jun, Zhang, Ke Shi, Hu, Hui Juan, Jiao, Gui Qiong (2010) Characterization of Tensile Damage for 3D-C/SiC Composites by Acoustic Emission. Advanced Materials Research, 97. 834-837 doi:10.4028/www.scientific.net/amr.97-101.834
Plain TextChang, Yan Jun, Zhang, Ke Shi, Hu, Hui Juan, Jiao, Gui Qiong (2010) Characterization of Tensile Damage for 3D-C/SiC Composites by Acoustic Emission. Advanced Materials Research, 97. 834-837 doi:10.4028/www.scientific.net/amr.97-101.834
In(n.d.) Advanced Materials Research Vol. 97. Trans Tech Publications, Ltd.

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